The first comprehensive text for the hot new multichip module technology Introduction to Multichip Modules is the first book to provide a comprehensive introduction to the technology of MCM-based electronic packaging-an innovation that has brought tremendous improvements in performance to computing systems of all kinds. A basic text and a professional reference in one, this book explores areas of relevance in both electrical engineering and computer science. It comes complete with review- and research-oriented problems, an extensive bibliography, and over 100 illustrations. Useful and instructive in many ways, Introduction to Multichip Modules: * Discusses the benefits as well as the problems arising from the compact packaging design of MCMs * Presents technical material in a systematic way, and supplements it with information on industrial developments and applications * Compares previous electronic packaging with the new technology in its discussion of the evolution of MCMs * Includes material relevant to diverse industrial segments, such as thermal management groups, CAD groups, electrical simulation, and interconnect analysis groups * Provides extensive technical information for designers of MCMs and MCM-based systems, while acting as a quick reference for CAD engineers involved in tool design for this technology. Ideal for university courses, Introduction to Multichip Modules can be used in advanced topics classes or research courses in multichip modules, electronic packaging, or CAD tools for MCMs. Multichip modules (MCMs) represent the latest in packaging technology for high-performance computing systems. Developed in response to advances in integrated circuit technology, especially VLSI technologies, MCMs' compact design of bare chips on multichip modules provides superior system performance and reliability, increased operating speed, and reduced system size and weight. At the same time, this design presents its own set of challenges and problems unlike anything in traditional, single-chip-module electronic packaging. These include excess heat, electronic noise, and new electronic phenomena occurring at higher operating frequencies. Introduction to Multichip Modules is the first book to provide complete coverage of the basics of this new technology for students and professionals alike. It covers all aspects of MCM, including classification, design, and CAD tools, and explains methods and materials used in the design of MCM-based systems. This book also examines the advantages and disadvantages of various types of design; demonstrates methods of improving system reliability; and discusses the advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this book is also useful to anyone who would like to know more about the evolution of this technology and where the new advances in the field may lead us.