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RF Measurements of Die and Packages Scott Wartenberg

RF Measurements of Die and Packages By Scott Wartenberg

RF Measurements of Die and Packages by Scott Wartenberg


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Summary

This text explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration.

RF Measurements of Die and Packages Summary

RF Measurements of Die and Packages by Scott Wartenberg

This text is dedicated to the issues surrounding RFIC (radio-frequency integrated circuit) testing. It explains how to perform high-accuracy RF measurements of die and packages in the RF test lab. It defines the essential elements in an RF system, explains where errors can be found in such a system and shows how to mathematically remove them with calibration. This book should be of interest to: RFIC designers and high-frequency digital IC designers, IC test engineers and IC manufacturing test engineers.

Table of Contents

Preface. Introduction, Calibration, Coplanar Probes. High-Volume Probing. Test Fixtures. On-Wafer Characterization. RF Test Systems. Package Characterization. Future Trends. Appendix.

Additional information

NPB9781580532730
9781580532730
158053273X
RF Measurements of Die and Packages by Scott Wartenberg
New
Hardback
Artech House Publishers
2002-05-31
244
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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