Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science by George Harman
Unfortunately we do not have a summary for this item at the moment
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science Summary
Additional information
CIN0930815254A
9780930815257
0930815254
Reliability and Yield Problems of Wire Bonding in Microelectronics: The Application of Materials and Interface Science by George Harman
Used - Well Read
Paperback
Unknown
0
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
This is a used book. We do our best to provide good quality books for you to read, but there is no escaping the fact that it has been owned and read by someone else previously. Therefore it will show signs of wear and may be an ex library book