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Life-Cycle Assessment of Semiconductors Sarah B. Boyd

Life-Cycle Assessment of Semiconductors By Sarah B. Boyd

Life-Cycle Assessment of Semiconductors by Sarah B. Boyd


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Summary

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices.

Life-Cycle Assessment of Semiconductors Summary

Life-Cycle Assessment of Semiconductors by Sarah B. Boyd

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes but is not limited to semiconductor manufacturing trends by product type and geography, unique coverage of life-cycle assessment, with a focus on uncertainty and sensitivity analysis of energy and global warming missions for CMOS logic devices, life cycle assessment of flash memory and life cycle assessment of DRAM. The information and conclusions discussed here will be highly relevant and useful to individuals and institutions.

Table of Contents

1 Introduction.- 2 Semiconductor LCI Methods.- 3 Semiconductor Manufacturing Trends in Product Type and Geography.- 4 Life-cycle Energy and Global Warming Emissions of CMOS Logic.- 5 Life-cycle Assessment of CMOS Logic.- 6 Life-cycle Assessment of Flash Memory.- 7 Life-cycle Assessment of Dynamic Random Access Memory.- 8 Semiconductor LCA: The Road Ahead.

Additional information

NPB9781441999870
9781441999870
1441999876
Life-Cycle Assessment of Semiconductors by Sarah B. Boyd
New
Hardback
Springer-Verlag New York Inc.
2011-10-12
226
N/A
Book picture is for illustrative purposes only, actual binding, cover or edition may vary.
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